Syllabus
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Course Code: EI-PC-201 Course Name: Smart & Micro Sensor Design |
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| MODULE NO / UNIT | COURSE SYLLABUS CONTENTS OF MODULE | NOTES |
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| 1 | MEMS: Introduction, principle of MEMS, Example of Mems, small and large scaling, fabrication technology, micromachining: photolithography, thin film deposition and doping, wet chemical etching, waferbonding, plasma etching, surface micromachining. | |
| 2 | Mechanics of Membrane and beams: dynamics, string, beams, diaphragms and membrane Transduction of Deformation: Metal strain gauges, Semiconductor Strain Gauges, Capacitive Transducers, Force and Pressure sensors: Force Sensors, Pressure sensors, Thermocouples Semi conducting Thermo resistors, Fiber Optical sensors, concept of smart and intelligent sensor, bio sensors. | |
| 3 | Acceleration Sensors: introduction, Bulk Michromachined Accelerometers, surface Michromachined accelerometers, force feedback, angular rate sensors, Flow Sensors: The laminar boundary layer, Heat Transport in the limit of very small Reynolds Numbers, Thermal Flow Sensors, Skin Friction Sensors, Dry fluid Flow Sensors, wet fluid flow sensors, Resonant Sensors: Basic principle and physics. | |
| 4 | Definition of intelligence and of intelligent instrumentation system: Features characterizing intelligence and Features intelligent instrumentation, component of intelligent instrumentation. Design of intelligent instrumentation systems. Smart and Intelligent transmitters, smart features standard for smart sensing, setting standards for smart sensors and system, IEEE 1451.1, IEEE 1451.2, STIM, IEEE P1451.3, IEEEP 1451.4, Field buses systems. |
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