Syllabus
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Course Code: EL 25 Course Name: Option - i) Foundations of MEMS |
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| MODULE NO / UNIT | COURSE SYLLABUS CONTENTS OF MODULE | NOTES |
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| 1 | MEMS & Microsystem- Definition, Intrinsic Characteristic of MEMS: Minitiarization, Microelectronics, Integration, Parallel Fabrication with Precision. Sensors and Actuator: Energy Domains and Transducers, Sensor Consideration, Actuator Considerations, Scaling in MEMS |
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| 2 | Microfabrication and Material for MEMS: Si as substrate material, mechanical properties of Silicon, Silicon Compounds (SiO2, Si3N4, SiC, polySi, Silicon), Piezoresistors, Piezoelectric crystals, Polymers, Packaging Materials. Micromachining Processes: Overview of microelectronic fabrication processes used in MEMS, Bulk Micromachining, Anisotropic wet etching, DRIE, Etch stop techniques, Surface Micromachining – General description, Case studies using MEMS Design Tools, Special Microfabrication Techniques (Introduction only): LIGA process, Low Temperature Cofired Ceramic (LTCC), HexSil Process, Bonding. |
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| 3 | Electrostatic Sensing and Actuation: Introduction, Parallel Plate Capacitor, Actuators based on thermal expansion, Applications- Interial Sensors, flowsensors, Piezoresistive sensors- origin and expressing of piezoresistivitiy, single crystal Silicon, Polycrystalline Silicon, Stress analysis of Mechanical Elements, Applications: tactile sensor, pressure sensor, few case studies using MEMS Design tools |
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| 4 | Piezoelectric Sensing and Actuation-Introduction: Mathematics Description of Piezoelectric Effects, Cantilever Piezoelectric Actuator Model, Application: Acoustic sensor Microfluidics- Motivation, Essential Biology concepts, Basic fluid Mechanic Concepts, Design and fabrication of Selected components channels, valves Case studies of selected MEMS Products: Blood pressure sensor, Microphone, acceleration sensor, gyros, few case studies using MEMS Design Tools |
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