Syllabus
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Course Code: MMVD 301 Course Name: Program Elective-I - Micro Electro Mechanical Systems (MEMS) |
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| MODULE NO / UNIT | COURSE SYLLABUS CONTENTS OF MODULE | NOTES |
|---|---|---|
| 1 | Overview of MEMS and Microsystems: Introduction Microsystem vs. MEMS, Microsystems and Microelectronics, the Multidisciplinary Nature of Microsystem design and manufacture, Application of MEMS in various industries. MEMS and Miniaturization: Scaling laws in miniaturization: Introduction to Scaling, Scaling in: Geometry, Rigid Body dynamics, Electrostatic forces, Electromagnetic forces, Electricity, Fluid Mechanics, Heat Transfer. Materials for MEMS and Microsystems – Si as substrate material, mechanical properties of Silicon, Silicon Compounds (SiO2, Si3N4, SiC, polySi, Silicon), Piezoresistors, GaAs, Piezoelectric crystals, Polymers, Packaging Materials. | |
| 2 | Micromachining Processes: Overview of microelectronic fabrication processes used in MEMS, Bulk Micromachining – Isotropic & Anisotropic Etching, Comparison of Wet vs Dry etching, Surface Micromachining – General description, Processing in general, Mechanical Problems associated with Surface Micromachining, Introduction to LIGA process, and Introduction to Bonding. Assembly of 3D MEMS - foundry process | |
| 3 | Microsystems & MEMS Design: Design Considerations: Design constraints, Selection of Materials, Selection of Manufacturing processes, Selection of Signal Transduction, Electromechanical system, packaging. Process design, Mechanical Design – Thermo mechanical loading, Thermo mechanical Stress Analysis, Dynamic Analysis, Interfacial fracture Analysis, Mechanical Design using Finite Element Method. | |
| 4 | Design case using CAD. Principles of Measuring Mechanical Quantities: Transduction from Deformation of Semiconductor Strain gauges: Piezo resistive effect in Single Crystal Silicon, Piezo resistive effect in Poly silicon Thin films, Transduction from deformation of Resistance. Capacitive Transduction: Electro mechanics, Diaphragm pressure sensors. Structure and Operation of Accelerometers, Resonant Sensors, Thermal Sensing and actuation. | |
