Syllabus
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Course Code: MMVD 101 Course Name: Process Technology for ULSI –I |
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| MODULE NO / UNIT | COURSE SYLLABUS CONTENTS OF MODULE | NOTES |
|---|---|---|
| 1 | Clean Room Technology, Clean Room Classifications, Design concepts, Clean Room Installations and Operations, Automation related facility systems, future trends. | |
| 2 | Wafer Cleaning Technology - Basic Concepts, Wet cleaning, Dry cleaning, Epitaxy, Fundamental Aspects, Conventional silicon epitaxy, low temperature, Epitaxy of silicon, selective epitaxial growth of Si, Characterization of epitaxial films. | |
| 3 | Process simulation, Introduction, Ion-implantation, Monte Carlo method, Diffusion and Oxidation, two-dimensional LOCOS simulation example, Epitaxy, Epitaxial doping model, Lithography, Optical projection lithography, Electron-beam lithography, Etching and deposition, future trends. | |
| 4 | VLSI Process Integration, Fundamental considerations for IC Processing, building individual layer, integrating the process steps, miniaturizing VLSI circuits, NMOS IC technology, fabrication process sequence, special consideration for NMOS ICs, CMOS IC technology, Fabrication Process sequence, special considerations for CMOS ICs, MOS memory IC technology, dynamic memory, static memory, bipolar IC technology, fabrication process sequence, special considerations for bipolar ICs, Self-aligned bipolar structures, Integrated injection logic, IC fabrication, process monitoring future trends. | |
